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Core capabilities: Design services incl. PCB design layout, simulation and validation, 3D mechanical design with full thermal testing and validation. Low, medium and high volume SMT manufacture including the handling of fine pitch QFPs, µBGA. Backplane manufacture & test including semi-automatic press fit and automated test assembly Cable and interconnect assembly capabilities in RF, power and signal with in-house over-moulding capability. Full system build and configuration for major platforms in telecom, medical, and industrial products. Total solutions package including supply chain management and logistics services. RoHS-compliant process.