Media coverage continues to grow after TT electronics-IMS announces that it has provided manufacturing services for the System Integrated Verification Bench (SIVB) for AVIAGE. The SIVB is used to test avionics equipment of the highly anticipated C919 aircraft project of China. Keep reading to view recent publications by the Chinese media.
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Lead-free package-on-package (PoP) technology is the latest in vertical electronics packaging integration and has become the preferred technology for mobile handheld electronics applications.